Sony today announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution of the camera. This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. This structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.
Hereafter, Sony will position it as the next generation back-illuminated CMOS image sensors, and unwaveringly strive to further develop this image sensor and expand its product lineup, thereby contributing to the further development of user-friendly cameras and to shooting enjoyment.
Features of stacked CMOS image sensor
- Large-scale signal processing circuits required for higher image quality and better functionality are built-in
- More compact image sensor chip size
- Even higher image quality of the pixel section by adopting manufacturing processes specialized for superior image quality
- Faster speeds and lower power consumption by adopting the leading process for the circuit section
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